服务热线：0086-510-86392762
|
| Silica slurry for CMP (SiO2) The most common abrasives used in CMP are silica, alumina and ceria, of which silica is the most widely used. Its bulk hardness is around Mohs 6. Some studies of colloidal silica have suggested its application as slurries for copper CMP in low K dielectric substrate materials. Colloidal silica manufacturing provides a reasonable control of particle size distribution. The zeta potential of particles in low pH slurry helps the particles to remain in suspension, resulting in a better particle distribution in the slurry. |
|
| |
|
| Alumina slurry for CMP (Al2O3) Alumina particles have been widely used in CMP, with bulk hardness of 8–9 Mohs, slightly higher than silica. In the slurry, a thin hydrolyzed layer, aluminum hydroxide, is formed that is soft (3–4 Mohs). This in consequence reduces its scratching tendency and maintains the material removal capability.
|
|
|
|
|
| Ceria slurry for CMP (CeO2) Ceria (CeO2) is one of the major abrasive materials used for CMP. Ceria has a low hardness (bulk Mohs about 6) compared with alumina and silica. It provides better uniformity and planarity. Ceria slurry is also widely used in CMP on both STI (shallow trench isolation) and ILD (Inner layer dielectric) applications.
|
|
|
|
|
| Monocrystalline diamond slurry Monocrystalline diamond slurry is the most cost effective solution to hard lapping such as ceramic, cast iron, metal material, optical crystal etc. It is with good dispensability, uniformly particle size distribution, both water and oil based are available, widely used for the hard materials lapping and processing. Application: * Sapphire substrate grinding and polishing; * Zinc selenide lapping polishing;Iphone6 camera lens lapping and polishing;hard disk heads lapping and polishing; * Metal lapping/grinding ;aluminum alloy lapping/grinding ; mould lapping/grinding; mould polishing; ceramic grinding/lapping; mobile phone shell/case lapping; * Piston Ring honing; |
|
|
|
|
| Polycrystalline diamond slurry The Polycrystalline diamond slurry can provide high removal rate without scratches, widely used for the lapping and processing of sapphire substrate, optic lens, hard glasses, crystals, ceramics, magnetic heads, hard disk and CMOS chip etc. Features: * Polycrystalline diamond powder is self-producting, which can ensure the queality of raw material; * Highly dispersed recipe can keep a high removal rate and not easy to cause scratches;
|
|
|
|
|
| Resemble polycrystalline diamond slurry
RCD diamond slurry takes resemble polycrystalline diamond powder as raw materials. With polydisperse formula, it can keep high and uniform removal rate and not easy to produce scratches. RCD diamond slurry is mainly used in grinding and polishing of sapphire material, optical lens, hard glass and crystal, superhard ceramic and alloy material etc. Features: * Rough surface can increase contact point in the polishing process; Enhance the polishing effect accordingly; * With good self-sharpening, can keep high removal rate; * With a large number of small cutting chins, can reduce surface roughness of the workpiece |
