Polyurethane polishing pad

Shore hardness: 75-90
Applicable slurry: alumina, cerium oxide, silica, etc.
Applicable processing stage: rough polishing, medium polishing
Product features: high wear resistance, long service life, good elasticity, high cost performance; high removal rate, low smoothness.
Customized: Shape, dimension and grooves can be customized according to customer requirements.
Application: sapphire, ceramics, glass, lithium niobate, GaAs, SiC, metal, etc.

Non-woven polishing pad

Shore hardness: 70-80
Applicable slurry: alumina, ceria, silica, etc.
Applicable processing stage: middle throw
Product features: high polishing rate, high flatness, low compression ratio and lower product defects, good product parameters.
Customized: Shape, dimension and grooves can be customized according to customer requirements.
Application: sapphire, ceramics, glass, lithium niobate, GaAs, SiC, metal, etc.

Damping cloth polishing pad

Shore hardness: 60-70
Applicable slurry: alumina, Ceria, silica, etc.
Applicable processing stage: medium polishing, fine polishing
Product features: high elasticity, high wear resistance, low processing efficiency, delicate product surface, low flatness.
Customized: Shape, dimension and grooves can be customized according to customer requirements.
Application: Polishing of GaAs, Ge, InP, GaN, sapphire, SiC, silicon, lithium niobate, laser crystal, etc.

Diamond polishing pad

Diameter: 150mm ~ 1500mm
Diamond particle size: 1-30um
Product features: high thinning rate, lower surface roughness, durable.
Customized: Shape, dimension and grooves can be customized according to customer requirements.
Application: Polishing of cover glass, glass ceramic, ceramic, stainless steel, metal, etc.

Iron grinding plate

Diameter: 150mm ~ 1500mm
Basic thickness: 45mm ~ 100mm
Grinding disc accuracy: parallelism ≤0.02mm, flatness ≤0.02mm
Customized: Shape, dimension and grooves can be customized according to customer requirements.
Application: Grinding of semiconductor materials, sapphire, quartz, precision optics, ceramics, metal, etc.

Copper grinding plate

Diameter: 150mm ~ 1500mm
Basic thickness: 45mm ~ 100mm
Grinding disc accuracy: parallelism ≤0.02mm, flatness ≤0.02mm
Customized: Shape, dimension and grooves can be customized according to customer requirements.
Application: Grinding of silicon, quartz, glass, ceramic, gallium arsenide and other thin and brittle metal or non-metal materials, etc.

Tin alloy grinding plate

Diameter: 150mm ~ 1500mm
Basic thickness: 45mm ~ 100mm
Grinding disc accuracy: parallelism ≤0.02mm, flatness ≤0.02mm
Customized: Shape, dimension and grooves can be customized according to customer requirements.
Application: Grinding of stainless steel, aluminum alloy , sapphire, ceramics, optical glass and semiconductor materials, etc.

Iron alloy grinding plate

Diameter: 150mm ~ 1500mm
Basic thickness: 45mm ~ 100mm
Grinding disc accuracy: parallelism ≤0.02mm, flatness ≤0.02mm
Customized: Shape, dimension and grooves can be customized according to customer requirements.
Application: Grinding of sapphire, silicon carbide, quartz crystal, optical glass, ceramic sheet, gallium arsenide, metal, etc.

Diamond grinding plate

Diameter: 150mm ~ 1500mm
Thickness: 45mm ~ 100mm
Grinding disc accuracy: parallelism ≤0.02mm, flatness ≤0.02mm
Customized: Shape, dimension and grooves can be customized according to customer requirements.
Application: Grinding of semiconductor wafers, diamond materials, tungsten steel (hard alloy), ceramics, sapphire, quartz, magnetic materials, metal, etc.