Laser micro-machining includs cutting, drilling, etching, marking, dicing, material removal, construction, carving and marking. Laser can be applied to the processing of various materials:
Stainless steel, aluminum, copper, copper, tungsten, molybdenum, titanium, nickel, platinum and other metals or superhard metals, and various alloys.
Alumina, zirconia, aluminum nitride and other ceramic materials.
Silicon, silicon carbide, gallium nitride and other semiconductor materials.
Transparent ceramics, glass, quartz and other transparent materials.

Application of laser micro-machining in various industries

In semiconductor industry, scribing using UV solid-state laser has become the mainstream technology in LED wafer manufacturing, instead of traditional tool scribing. Scribing using laser can achieve smaller line width, almost no edge collapse and microcracks, so as to achieve higher brightness, better stability and higher electro-optic conversion efficiency of LED chip.

In the electronic industry, with the rapid development of consumer electronic products, driving the development of upstream industries, high-quality PCB drilling, flexible PCB drilling, ITO film etching, special pattern marking and other laser micro processing applications are also developing rapidly.

In the display industry, laser is used for cutting full screen chamfer, flexible OLED cutting, double-layer glass module cutting, flexible module cutting and other applications.

In the field of intelligent terminal, laser processing technology can be used in touch screen (conductive film etching), fingerprint identification / camera module (cover plate cutting, LGA / CCM module cutting / marking, polarizer cutting, FPC cutting / marking), vehicle / mobile phone cover plate (glass abnormity cutting / drilling), mobile phone ceramic frame / back cover cutting, etc.

Application examples of laser micromachining

Optical mask made of sapphire (laser processing: cutting shape, slotting, drilling.)
Optical mask is widely used in lithography, such as IC (Integrated Circuit), FPD (Flat Panel Display), PCB (Printed Circuit Boards, printed circuit board ), MEMS (Micro Electro Mechanical Systems), etc.

Scribing and drilling on ceramic substrate  (minimum thickness: 0.03 mm, accuracy: +/- 5 um)

cutting of transparent material  (applicable materials such as quartz, sapphire, transparent ceramics, etc.)